ARM and United Microelectronics Corporation announced the availability of a new ARM Artisan physical IP solution on 55nm to accelerate the development of ARM processor-based embedded systems and Internet of Things (IoT) applications.
UMC’s 55nm ultra-low-power process (55ULP) technology is emerging as an ideal solution for energy-efficient IoT applications. The new physical IP offering will enable silicon design teams to speed up and simplify the bring-up of ARM-based SoC designs for IoT and other embedded applications.
For many energy-constrained applications, maximizing battery life is critical to a successful design. The Artisan physical IP platform will enhance the ULP technology from UMC with the intent to maximize power efficiency and reduce leakage. Features such as thick gate oxide support and long, multi-channel library options give SoC designers multiple tools to help optimize IoT applications.
“A complete physical IP foundation platform at UMC’s 55ULP process technology is vital in enabling low-power and cost-sensitive designs for emerging IoT applications,” said Will Abbey, general manager, physical design group, ARM. “By delivering libraries optimized with features targeting power-efficiency, ARM and UMC are providing SoC designers with a comprehensive set of new tools.”
“IoT silicon designers are being asked to deliver more highly integrated solutions within more power constrained environments, and more quickly,” said Shih-Chin Lin, senior director of IP development and design support division at UMC. “UMC possesses the foundry industry’s most robust IoT-specific 55nm technology platform, supported by highly comprehensive IP resources to address the “always on” ultra-low power requirements of IoT products. The addition of Artisan Physical IP to our 55ULP platform immediately increases the breadth of tools we can offer to reduce complexities and time to market.”
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